“Impact” laser radiation is used to selectively ablate, drill and mill polymer materials, to expose contact areas, excise flex circuits and for other demanding applications, including fluorinated polymers. The LLT incorporates a modified CO2 TEA laser with output in the 9.3-9.6μm band, and short pulse duration resulting in high absorbed power densities, that vaporize polymers. Machining rates (material removal) are typically on the order of 5-505μm depth /shot, depending on the energy density.
特長
- Clean removal of polymer layers by ablation
- No damage to metallization or substrate
- PC selection of ablation motif
- Motorized X, Y, Z Axis for 3d packaging
- Auto Switch from ablation to excision mode
- Auto align to fiducials
- CAD compatible
- Efficient fume extraction
- Easy to use
Applications
- Trimming of electronics packaging / contact clean
- Milling/drilling of a wide range of polymers & composites
- Tablet drilling
ソフトウェア
制御ソフトはオプテック社独自のレーザー加工制御ソフトProcessPowerを使用しております。
CADファイル変換機能、CADデータに基づいて加工
仕様
- Laser : C02 Light Machinery Impact 2000 Series
- Operating Wavelength: 9.3μm
- Pulse Energy: 400mJ-4J
- Repetition Rate: 150Hz-15Hz
- On-target e.d: 4-16J/cm2 (Ablation); >50J/cm2 (excision), Auto Change
- Motifs: up to 2mm in static mode, user choice on 15 pos. selector, or up to 10x10mm in scanning mode (option)
- Part Holding: Vacuum chuck and/or wafer clamps
- Environment: Fume extractor/filter
- X, Y machining area: 300*300mm (larger sizes available)
- Speed/position resolution: 30mm/s, 1μm (fast linear drive stages available)
- Theta stage option: 360° full rotation or +/-3° auto-trim stage options
- Focus depth/part height (Z axis): 25mm
- CCTV inspection: Offset detented zoom, 45-300X; image acquisition
- Control Software: ProcessPower multi-level access, user-friendly interface with set-up & CAD conversion routines, auto-align functions and video measuring cursor